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z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com specification STW8T36B ssc customer drawn approval approval
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com contents 1. description 2. absolute maximum ratings 3. electro - optical characteristics 4. optical characteristics 5. reliability test 6. color & binning 7. bin code description 8. outline dimension 9. reel structure 10. packing 11. soldering 12. precaution for use 13. handling of silicone resin leds
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com features applications ? white colored smt package. ? pb - free reflow soldering application ? suitable for all smt assembly methods ; suitable for all soldering methods ? rohs compliant ? interior lighting ? general lighting ? indoor and out door displays ? architectural / decorative lighting this surface - mount led comes in standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. the die is attached within the reflector cavity and the cavity is encapsulated by silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability. 1. description STW8T36B STW8T36B
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 3. electro - optical characteristics parameter symbol condition min. typ. max. unit forward voltage (per die) * v f i f =20ma 2.9 3.2 3.5 v reverse current (per die) v r v f =5v - - 10 a luminous intensity* [1] (3,700~8,200 k) i v i f =60ma - 6.3 - cd luminous intensity* [1] (2,600~3,700 k) i v i f =60ma - 5.5 - cd color correlated temperature cct i f =60ma 2,600 - 8,200 k viewing angle [2] 2 1/2 i f =60ma - 120 - deg. color rendering index* ra i f =60ma 75 80 - - esd (hbm) 1.5k ? ;100p f 1 - - kv thermal resistance [3] r th jp i f =60ma 22 oc/w [1] the luminous intensity iv was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the led package. [2] 2 1/2 is the off - axis where the luminous intensity is 1/2 of the peak intensity. [3] thermal resistance: rthjs (junction / solder) * tolerance : vf : 0.1v, iv : 10%, ra : 3, x,y : 0.01 [note] all measurements were made under the standardized environment of ssc. parameter symbol value unit power dissipation p d 324 mw forward current i f 90 ma operating temperature t opr - 40~+85 storage temperature t stg - 40~+100 junction temperature t j 125 [1] care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. * leds properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. 2. absolute maximum ratings [1]
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 4. optical characteristics ambient temperature vs. maximum forward current (per die) forward voltage vs . forward current (per die) ta= 25 forward current vs . relative luminous intensity ta= 25 directivity ta= 25 - 90 60 30 0 - 30 - 60 90 -25 0 25 50 75 100 0 5 10 15 20 25 30 35 forward current i f [ma] ambient temperature ta ( o c ) 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 0 10 20 30 40 50 60 70 80 90 forward current i f [ma] forward voltage v f [v] 0 10 20 30 40 50 60 70 80 90 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 relative luminous intensity forward current i f [ma]
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 4. optical characteristics relative light output vs . junction temperature i f = 60 ma forward voltage shift vs . junction temperature i f = 60 ma spectrum ta= 25 , i f = 60 ma 300 400 500 600 700 800 0.0 0.5 1.0 4700~8200k 3700~4700k 2600~3700k relative emission intensity wavelength [nm] 30 45 60 75 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 relative forward voltage junction temperature tj ( o c ) 30 45 60 75 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 relative light output junction temperature tj ( o c )
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 5. reliability test item reference test conditions duration / cycle number of damaged thermal shock eiaj ed - 4701 t a = - 40 o c(30min) ~ 100 o c(30min) 10 0 cycle 0/22 high temperature storage eiaj ed - 4701 t a =100 o c 1000 hours 0/22 high temp. high humidity storage eiaj ed - 4701 t a =60 o c, rh=90% 1000 hours 0/22 low temperature storage eiaj ed - 4701 t a = - 40 o c 1000 hours 0/22 operating endurance test internal reference t a =25 o c, i f =60ma 1000 hours 0/22 high temperature high humidity life test internal reference t a =60 o c, rh=90%, i f =60ma 500 hours 0/22 high temperature life test internal reference t a =85 o c, i f =60ma 500 hours 0/22 low temperature life test internal reference t a = - 40 o c, i f =60ma 1000 hours 0/22 esd(hbm) mil - std - 883d 1kv at 1.5k?; 100pf 3 time 0/22 reflow t sol 260 < 10sec. reflow soldering 3 time 0/22 item symbol condition criteria for judgment min max forward voltage v f i f =60ma - usl [1] 1.2 luminous intensity i v i f =60ma lsl [2] 0.7 - note : [1] usl : upper standard level [2] lsl : lower standard level criteria for judging the damage
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 6. color & binning energy star rank 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 h3 h5 h1 h4 h2 h0 g5 g3 g1 g4 g2 g0 f5 f3 f1 f4 f2 f0 e5 e3 e1 e4 e2 d0 d5 d3 d1 d4 d2 e0 c5 c3 c1 c4 c2 c0 b5 b3 b1 b4 b2 b0 a3 a5 a1 a4 a2 a0 z7 z5 z3 z1 z6 z4 2600k 2700k 2900k 3000k 3200k 3500k 3700k 4000k 4200k 4500k 4700k 5000k 5300k 5600k 6000k 6500k 7000k 7600k cie y cie x 8200k z2
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning z1 z2 z3 cie x cie y cie x cie y cie x cie y 0.2959 0.3227 0.291 0.3093 0.2976 0.3166 0.2976 0.3166 0.293 0.3037 0.2993 0.3107 0.3041 0.324 0.2993 0.3107 0.3055 0.3177 0.3028 0.3304 0.2976 0.3166 0.3041 0.324 z4 z5 z6 cie x cie y cie x cie y cie x cie y 0.293 0.3037 0.2993 0.3107 0.295 0.298 0.295 0.298 0.3009 0.3047 0.2969 0.2919 0.3009 0.3047 0.3068 0.3113 0.3025 0.2985 0.2993 0.3107 0.3055 0.3177 0.3009 0.3047 z7 cie x cie y 0.3009 0.3047 0.3025 0.2985 0.3082 0.3046 0.3068 0.3113
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning a0 a1 a2 cie x cie y cie x cie y cie x cie y 0.3028 0.3304 0.3115 0.3393 0.3041 0.324 0.3041 0.324 0.3126 0.3324 0.3055 0.3177 0.3126 0.3324 0.321 0.3408 0.3136 0.3256 0.3115 0.3393 0.3205 0.3481 0.3126 0.3324 a3 a4 a5 cie x cie y cie x cie y cie x cie y 0.3126 0.3324 0.3055 0.3177 0.3136 0.3256 0.3136 0.3256 0.3068 0.3113 0.3146 0.3187 0.3216 0.3334 0.3146 0.3187 0.3221 0.3261 0.321 0.3408 0.3136 0.3256 0.3216 0.3334 b0 b1 b2 cie x cie y cie x cie y cie x cie y 0.3207 0.3462 0.3292 0.3539 0.3212 0.3389 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 0.3292 0.3539 0.3376 0.3616 0.3293 0.3461 b3 b4 b5 cie x cie y cie x cie y cie x cie y 0.3293 0.3461 0.3217 0.3316 0.3293 0.3384 0.3293 0.3384 0.3222 0.3243 0.3294 0.3306 0.3369 0.3451 0.3294 0.3306 0.3366 0.3369 0.3373 0.3534 0.3293 0.3384 0.3369 0.3451
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning c0 c1 c2 cie x cie y cie x cie y cie x cie y 0.3376 0.3616 0.3463 0.3687 0.3373 0.3534 0.3373 0.3534 0.3456 0.3601 0.3369 0.3451 0.3456 0.3601 0.3539 0.3669 0.3448 0.3514 0.3463 0.3687 0.3552 0.376 0.3456 0.3601 c3 c4 c5 cie x cie y cie x cie y cie x cie y 0.3456 0.3601 0.3369 0.3451 0.3448 0.3514 0.3448 0.3514 0.3366 0.3369 0.344 0.3428 0.3526 0.3578 0.344 0.3428 0.3514 0.3487 0.3539 0.3669 0.3448 0.3514 0.3526 0.3578 d0 d1 d2 cie x cie y cie x cie y cie x cie y 0.3548 0.3736 0.3641 0.3804 0.3536 0.3646 0.3536 0.3646 0.3625 0.3711 0.3523 0.3555 0.3625 0.3711 0.3714 0.3775 0.3608 0.3616 0.3641 0.3804 0.3736 0.3874 0.3625 0.3711 d3 d4 d5 cie x cie y cie x cie y cie x cie y 0.3625 0.3711 0.3523 0.3555 0.3608 0.3616 0.3608 0.3616 0.3511 0.3465 0.359 0.3521 0.3692 0.3677 0.359 0.3521 0.367 0.3578 0.3714 0.3775 0.3608 0.3616 0.3692 0.3677
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning e0 e1 e2 cie x cie y cie x cie y cie x cie y 0.3736 0.3874 0.3869 0.3958 0.3714 0.3775 0.3714 0.3775 0.3842 0.3855 0.3692 0.3677 0.3842 0.3855 0.397 0.3935 0.3813 0.3751 0.3869 0.3958 0.4006 0.4044 0.3842 0.3855 e3 e4 e5 cie x cie y cie x cie y cie x cie y 0.3842 0.3855 0.3692 0.3677 0.3813 0.3751 0.3813 0.3751 0.367 0.3578 0.3783 0.3646 0.3934 0.3825 0.3783 0.3646 0.3898 0.3716 0.397 0.3935 0.3813 0.3751 0.3934 0.3825 f0 f1 f2 cie x cie y cie x cie y cie x cie y 0.3996 0.4015 0.4146 0.4089 0.396 0.3907 0.396 0.3907 0.4104 0.3978 0.3925 0.3798 0.4104 0.3978 0.4248 0.4048 0.4062 0.3865 0.4146 0.4089 0.4299 0.4165 0.4104 0.3978 f3 f4 f5 cie x cie y cie x cie y cie x cie y 0.4104 0.3978 0.3925 0.3798 0.4062 0.3865 0.4062 0.3865 0.3889 0.369 0.4017 0.3751 0.4198 0.3931 0.4017 0.3751 0.4147 0.3814 0.4248 0.4048 0.4062 0.3865 0.4198 0.3931
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning g0 g1 g2 cie x cie y cie x cie y cie x cie y 0.4299 0.4165 0.443 0.4212 0.4248 0.4048 0.4248 0.4048 0.4374 0.4093 0.4198 0.3931 0.4374 0.4093 0.4499 0.4138 0.4317 0.3973 0.443 0.4212 0.4562 0.426 0.4374 0.4093 g3 g4 g5 cie x cie y cie x cie y cie x cie y 0.4374 0.4093 0.4198 0.3931 0.4317 0.3973 0.4317 0.3973 0.4147 0.3814 0.4259 0.3853 0.4436 0.4015 0.4259 0.3853 0.4373 0.3893 0.4499 0.4138 0.4317 0.3973 0.4436 0.4015 h0 h1 h2 cie x cie y cie x cie y cie x cie y 0.4562 0.426 0.4687 0.4289 0.4499 0.4138 0.4499 0.4138 0.462 0.4166 0.4436 0.4015 0.462 0.4166 0.474 0.4194 0.4551 0.4042 0.4687 0.4289 0.481 0.4319 0.462 0.4166 h3 h4 h5 cie x cie y cie x cie y cie x cie y 0.462 0.4166 0.4436 0.4015 0.4551 0.4042 0.4551 0.4042 0.4373 0.3893 0.4483 0.3919 0.4666 0.4069 0.4483 0.3919 0.4593 0.3944 0.474 0.4194 0.4551 0.4042 0.4666 0.4069
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 7. bin code description available ranks not yet available ranks [note] all measurements were made under the standardized environment of ssc. in order to ensure availability, single color rank will not be orderable. [1] classification criteria : luminous intensity iv [2] please use for only reference. bin code luminous intensity [mcd] color rank forward voltage [v] n5 a1 z3 average for total forward voltage [v] @ i f = 60ma rank min. max. y3 2.9 3.0 z1 3.0 3.1 z2 3.1 3.2 z3 3.2 3.3 a1 3.3 3.4 a2 3.4 3.5 2,600k ~ 8,200k luminous intensity [mcd] @ i f = 60ma flux [lm] rank min. max. typ. n0 5,000 5,500 16.0 n5 5,500 6,000 17.2 p0 6,000 6,500 18.5 p5 6,500 7,000 19.7 q0 7,000 7,500 21.2 q5 7,500 8,000 22.6 color rank @ i f = 60ma z~h cct iv rank 3700~8200 k n0 n5 p0 p5 q0 q5 2600~3700 k n0 n5 p0 p5 q0 q5
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 8.outline dimension ( tolerance : 0 . 2 , unit : mm ) right view front view rear view 4 5 6 1 2 3 package marking (cathode) package outlines white cathode w3 w2 w1 white anode circuit diagram 3 4 2 5 6 1 recommended solder pad
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 5.7 0.1 (4.75) 12.0 0.2 5.3 2.1 0.1 1.75 0.1 5.5 0.05 0.3 - 0.05 4 0.1 2 0.05 8 0.1 9. reel structure ( tolerance : 0 . 2 , unit : mm ) 1) quantity : 1,200pcs/reel 2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm 3) adhesion strength of cover tape : adhesion strength to be 0.1 - 0.7n when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package 180 2 13 22 60 15.4 1.0 13 0.3 package marking
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 10. packing 1 side outer box structure material : paper(sw3b(b)) ? ? ? humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. type size (mm) ? ? ? 7inch 245 220 102 245 220 142
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 11. soldering (1) lead solder (2) lead - free solder (3) hand soldering conditions do not exceed 4 seconds at maximum 315oc under soldering iron. [note] in case that the soldered products are reused in soldering process, we dont guarantee the products. (4) the encapsulated material of the leds is silicone. precautions should be taken to avoid the strong pressure on the encapsulated part. so when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. (5) it is recommended that the customer use the nitrogen reflow method. (6) repairing should not be done after the leds have been soldered. (7) reflow soldering should not be done more than two times. in the case of more than 24 hours passed soldering after first, leds will be damaged. lead solder pre - heat 120~150 pre - heat time 120 sec. max. peak - temperature 240 max. soldering time condition 10 sec. max. lead free solder pre - heat 150~200 pre - heat time 120 sec. max. peak - temperature 260 max. soldering time condition 10 sec. max. lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. lead-free solder 1~5 c / sec. o o o o 1~5 c / sec. pre-heating 150~200 c 120sec. max. 60sec. max. above 220 c o 260 c max. 10 sec. max.
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 12. precaution for use 1) storage in order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. otherwise, to store them in the following environment is recommended. temperature : 5oc ~30oc humidity : maximum 70%rh 2) attention after open. led is correspond to smd, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. attention in followed; a. after opened and mounted the soldering shall be quickly. b. keeping of a fraction temperature : 5 ~ 40oc humidity : less than 30% 3) in the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10 - 12hr. at 60 5oc. 4) silver plating might be tarnished in the environment that contains corrosive gases and materials. also any product that has tarnished lead might be decreased the solder - ability and optical - electrical properties compare to normal ones. please do not expose the product in the corrosive environment during the storage. 5) any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. 6) quick cooling shall be avoided. 7) components shall not be mounted on warped direction of pcb. 8) anti radioactive ray design is not considered for the products. 9) this device should not be used in any type of fluid such as water, oil, organic solvent etc. when washing is required, ipa should be used. 10) when the leds are illuminating, operating current should be decided after considering the ambient maximum temperature. 11) the leds must be soldered within seven days after opening the moisture - proof packing. 12) repack unused products with anti - moisture packing, fold to close any opening and then store in a dry place. 13) the appearance and specifications of the product may be modified for improvement without notice. 14) please note the information contained herein is subject to change. ssc reserves the right to modify or change the design of led package inside structure without prior notice unless optical performance changes. 15) we recommend using solder paste composed of agcusn, because pastes that contain bi or b might cause color change of ag during surface mount technology.
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) ssc - STW8T36B february 2013 www.seoulsemicon.com 13. handling of silicone resin leds 1) during processing, mechanical stress on the surface should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. 2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can also become scratched. 3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. 4) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the handling of such devices. compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) ssc suggests using isopropyl alcohol for cleaning. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. 6) please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space.

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